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XC17S40XLPDG8C

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XC17S40XLPDG8C

Xilinx
XC17S40XLPDG8C
IC PROM PROG C-TEMP 3.3V 8-DIP

$5.14

Xilinx

Xilinx

Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).

Bostock Quality Assurance

XC17S40XLPDG8C Description

Get top-notch XC17S40XLPDG8C components from Xilinx at szcomponents.com. Our XC17S40XLPDG8C parts undergo strict quality control to meet industry standards, ensuring reliability and performance. The XC17S40XLPDG8C is parts of the Configuration Proms for FPGAs in Obsolete It requires a supply voltage ranging from 3V ~ 3.6V. This part number works in temperatures from 0°C ~ 70°C. The XC17S40XLPDG8C offers Mounting Type features such as Through Hole. The XC17S40XLPDG8C provides a 8-DIP (0.300", 7.62mm) package/case. It is designed for surface mount applications in a 8-PDIP package. The production status marked on szcomponents.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the XC17S40XLPDG8C Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.

Product Attributes

TYPEDESCRIPTIONSelect all
Supplier Device Package8-PDIP
PackageTube
Product StatusObsolete
ProgrammableNot Verified
Programmable TypeOTP
Memory Size400kb
Supply Voltage3V ~ 3.6V
Operating Temperature0°C ~ 70°C
Mounting TypeThrough Hole
Package / Case8-DIP (0.300", 7.62mm)

$5.14

Xilinx

Xilinx

Xilinx stands as a preeminent purveyor of All Programmable Field-Programmable Gate Arrays (FPGAs), System on Chips (SoCs), Multiprocessor System on Chips (MPSoCs), and Three-Dimensional Integrated Circuits (3D ICs). AMD stands in a distinctive position, facilitating applications that embody a dual nature of software-defined sophistication and hardware-honed optimization. This empowering of industries finds its zenith in the realms of Cloud Computing, 5G Wireless Connectivity, Embedded Vision, and the sprawling domain of Industrial Internet of Things (IIoT).

Bostock Quality Assurance

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