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Manufacturer

  • Altera
  • Analog Devices Inc./Maxim Integrated
  • Cypress Semiconductor Corp
  • Infineon Technologies
  • Intel
  • Microchip Technology
  • National Semiconductor
  • Renesas Electronics America Inc.
  • Texas Instruments
  • Xilinx

Series

  • *
  • -
  • 386™
  • 82810
  • 82810E
  • 82848P
  • DP8420V
  • DP8421A
  • DP8422A
  • DP8422V
  • DP8429
  • DP8440-25
  • DP84T22
  • EZ-USB NX2LP-Flex™
  • EZ-USB NX2LP™
  • Intel® 3
  • Intel® 810E
  • Intel® 850
  • Intel® 852GME
  • Intel® E7500
  • Intel®4
  • Intel®940
  • Intel®E7000
  • Pentium® 4
  • Pentium™

Package

  • Bag
  • Bulk
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at
  • Last Time Buy
  • Obsolete

Controller Type

  • -
  • CompactFlash
  • Controller Hub
  • Dynamic RAM (DRAM)
  • Firmware Hub
  • Graphics and Memory Controller
  • NAND Flash - USB
  • Nonvolatile RAM
  • Nonvolatile SRAM
  • NVMe Controller
  • Smartsocket SRAM
  • Smartwatch RAM
  • Smartwatch ROM
  • Static RAM (SRAM)

Voltage - Supply

  • -
  • 1.14V ~ 1.26V
  • 1.2V
  • 1.425V ~ 1.575V
  • 1.7V ~ 1.9V
  • 1V ~ 1.1V, 1.425V ~ 1.575V
  • 2.25V ~ 3.6V
  • 2.5V
  • 3V ~ 3.6V
  • 4.5V ~ 5.5V
  • 4.75V ~ 5.25V
  • 4.75V ~ 5.5V

Operating Temperature

  • -
  • -20°C ~ 70°C
  • -40°C ~ 85°C
  • 0°C ~ 70°C
  • 0°C ~ 70°C (TA)
  • 0°C ~ 70°C (TC)
  • 0°C ~ 75°C (TC)
  • 0°C ~ 85°C (TC)
  • 100°C
  • 104°C (TC)
  • 105°C (TC)
  • 99°C (TC)

Mounting Type

  • -
  • Surface Mount
  • Through Hole

Package / Case

  • -
  • 100-BQFP
  • 100-QFP Bumpered
  • 1005-BBGA, FCBGA
  • 1077-BBGA, FCBGA
  • 1085-BGA, FCBGA
  • 1202-BGA, FCBGA
  • 1202-FBGA, FCBGA
  • 1210-BGA, FCBGA
  • 1257-BBGA, FCBGA
  • 132-BCPGA
  • 132-BQFP Bumpered
  • 1329-BFBGA, FCBGA
  • 14-DIP (0.300", 7.62mm)
  • 144-LQFP
  • 16-DIP (0.300", 7.62mm)
  • 16-SOIC (0.154", 3.90mm Width)
  • 16-SOIC (0.295", 7.50mm Width)
  • 16-TSSOP (0.173", 4.40mm Width)
  • 20-DIP (0.300", 7.62mm)
  • 20-SOIC (0.295", 7.50mm Width)
  • 20-TSSOP (0.173", 4.40mm Width)
  • 208-BFQFP
  • 253-LFBGA, FCCSP
  • 28-DIP (0.600", 15.24mm)
  • 28-DIP (0.600", 15.24mm) Socket
  • 28-LCC (J-Lead)
  • 32-DIP (0.600", 15.24mm) Socket
  • 32-LCC (J-Lead)
  • 421-BBGA
  • 48-CDIP (0.600", 15.24mm) Window
  • 48-DIP
  • 48-TFBGA, FCCSPBGA
  • 52-CDIP (0.600", 15.24mm) Window
  • 53-TFBGA, FCCSP
  • 544-BBGA
  • 56-VFBGA
  • 56-VFQFN Exposed Pad
  • 68-CLCC
  • 68-CPGA
  • 68-LCC (J-Lead)
  • 732-BGA, FCBGA
  • 8-DIP (0.300", 7.62mm)
  • 8-SOIC (0.154", 3.90mm Width)
  • 84-LCC (J-Lead)
  • 932-BGA, FCBGA
  • 998-BGA, FCBGA
  • Die

Supplier Device Package

  • -
  • 100-QFP
  • 100-QFP (14x20)
  • 1005-FCBGA (42.5x42.5)
  • 1077-FCBGA (42.5x42.5)
  • 1085-FCBGA (27x27)
  • 1202-FCBGA (34x34)
  • 1210-FCBGA
  • 1257-FCBGA (40x37.5)
  • 132-CPGA (36.8x36.8)
  • 132-PQFP (24.13x24.13)
  • 1329-FCBGA (34x34)
  • 14-PDIP
  • 144-TQFP (20x20)
  • 16-PDIP
  • 16-SOIC
  • 16-TSSOP
  • 20-PDIP
  • 20-SOIC
  • 20-TSSOP
  • 208-QFP (28x28)
  • 253-FCCSP (8x13.5)
  • 28-DIP Socket
  • 28-PDIP
  • 28-PLCC (11.51x11.51)
  • 32-DIP Socket
  • 32-PLCC
  • 421-PBGA (31x31)
  • 48-CDIP
  • 48-DIP
  • 48-FCCSP (3x8)
  • 52-CDIP
  • 53-FCCSP (7.5x3)
  • 544-BGA (35x35)
  • 56-QFN (8x8)
  • 56-QFN-EP (8x8)
  • 56-Sawn QFN-EP (8x8)
  • 56-VFBGA (5x5)
  • 68-CLCC
  • 68-CPGA
  • 68-PLCC
  • 68-PLCC (25.13x25.13)
  • 732-Micro-FCBGA (37.5x37.5)
  • 8-PDIP
  • 8-SOIC
  • 84-PLCC (29.31x29.31)
  • 932-FCBGA (37.5x37.5)
  • 998-FCBGA (27x27)
  • Die

Media

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Products - Record(s)

UPD48576236FF-E24Y-DW1-E2-A

Renesas Electronics America Inc.

DDR DRAM, 16MX36

QG82915PL

Intel

EXPRESS CHIPSET

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