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EL5223CL

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EL5223CL

Intersil
EL5223CL
IC BUFFER 8 CIRCUIT 24QFN

Obsolete

Intersil

Intersil

Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.

Bostock Quality Assurance

EL5223CL Description

Get top-notch EL5223CL components from Intersil at szcomponents.com. Our EL5223CL parts undergo strict quality control to meet industry standards, ensuring reliability and performance. The EL5223CL is a Instrumentation, OP Amps, Buffer Amps with Obsolete product status. The device is offered in 8 Number of Circuits. This part number works in temperatures from -40°C ~ 85°C. The EL5223CL offers Mounting Type features such as Surface Mount. The EL5223CL provides a 24-VFQFN Exposed Pad package/case. This part number is supplier device package of 24-QFN (5x4). The production status marked on szcomponents.com is for reference only. If you didn't find what you were looking for, you can get more valuable information by emails, such as the EL5223CL Inventory quantity, preferential price, datasheet, and manufacturer. We are always happy to hear from you, so feel free to contact us.

Product Attributes

TYPEDESCRIPTIONSelect all
Cut-off Frequency12 MHz
Supplier Device Package24-QFN (5x4)
Output TypeRail-to-Rail
Mounting TypeSurface Mount
Number of Circuits8
Operating Temperature-40°C ~ 85°C
Type of AmplifierBuffer
Maximum Supply Span Voltage16.5 V
Product StatusObsolete
Minimum Supply Span Voltage4.5 V
PackageTube
Current - Output / Channel200 mA
Current - Supply5.7mA (x2 Channels)
Input Offset Voltage500 µV
Current - Input Bias2 nA
Slew Rate18V/µs
Package / Case24-VFQFN Exposed Pad

Obsolete

Intersil

Intersil

Commencing January 1, 2018, Renesas and Intersil will unify, augmenting semiconductor potentials. This fusion melds Renesas' lauded MCU and SoC proficiencies with Intersil's power management and precision analog mastery. Resultant growth spans automotive, industrial, and broader domains, facilitating agile response to patrons' needs. The amalgamation, initiated in February 2017, blossomed in July under "One Global Renesas," catalyzing a synergistic effect. Join Renesas in fortifying its semiconductor market eminence.

Bostock Quality Assurance

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